Axiomatic System Design for Non-thermal Dicing of Quartz Wafers

In the manufacture of light emitting diodes (LEDs), the process of dicing that separates fabricated chips into pieces from quartz wafers is critically important as it determines the quality and productivity of produced LEDs. However, traditional methods using either mechanical grinding wheels or relatively long pulse lasers suffers mechanical or thermal defects such as debris, cracks, heat-affected zone and large dicing width. In this work, an axiomatic design approach is used to develop a novel high-brightness wafer dicing machine that allows minimized mechanical thermal effects with the aid of ultrafast femtosecond laser pulses.